Related/CPU/Chipset

Research and Information Links for Intel related CPU's/Chipsets etc.

Information is provided to assist our customers in making the correct purchase decision(s), and avoid many of the most common issues faced regarding Intel CPU's and Motherboard compatibility issues. Complete research is strongly recomended. Our RMA/Tech Support Dept.is available to help clarify information specific to customers needs. Please keep in mind that if you own a brand name system such as Dell, Compaq, Gateway etc. you are encouraged to contact the manufacturer of your system to obtain complete technical specifications and upgrade path's available per system design by the respective manufacturer. Axion Technologies provides this information and service to our customers to augment their reasearch and to help clarify. Complete research is the Customers responsibility, and Axion Technologies will not/cannot make guarantee's regarding compatibility and or support. We will gladly assist our customers in answering questions regarding Specifications for any product we sell to help you determine the correct upgrade or assembly purchase. .

Intel Motherboard resources-selector

Intel Memory (RAM) resources-Information

Intel Processor ID Utility

Intel Heatsink Installation Guide Socket 370

Intel Heatsink Installation Guide Socket 478

Pentium 4 CPU Information-Socket 423/478

Pentium III Information-Socket 370

Intel chipset Drivers-information on Intel chipset boards

VIA Chipset drivers-MVP3/694x/P4-Socket 7/370/423-478

SiS Chipset drivers for Intel Platform

The Socket 370 and later CPU's are a Flip-Chip design. meaning the Die of the CPU is placed on the top of the CPU to allow better cooling. the Die of any CPU is fragile, and may be easily damaged. Axion Technologies HIGHLY recommends customers make certain proper installation procedures are followed. failure to do so or use of the incorrect components together can lead to physical damage and/or a voided warranty.

*Please note that thermal compound (AKA thermal "grease") should ONLY be applied to the CPU's Die. NEVER apply thermal compound to any area other than the die of the CPU. application of thermal compound to areas other than the die will cause overheating, and/or CPU failure.

**Overclocking is done at your risk. Overclocking is attempting to operate any component at speeds/voltages higher/different than those set by the manufacturer. components that are damaged, or fail after overclocking are not covered by warranty, nor are components that may be damaged or fail due to overclocking (I.e. Motherboard, RAM...)

Please make certain of compatibility between your motherboard and CPU. Intel CPU's are available in 100 and 133MHz operating bus speeds.

P-III's socket 370 CPU's based on the coppermine core can be easily identified as shown below.

There are significant differences in the Coppermine core vs. the Tualatin core P-III. before placing a Tualatin core P-III in any motherboard, please make certain the newer Core is supported. Failure to verify compatibility can result in damaged components.

Tualatin core P-III's can be identified by thier voltage and the addition of a heat transfer plate mounted to the CPU.

*Note there are some model PIII's that come with the heat plate, but are NOT Tualatin-they are Coppermine P-III's. do not rely on quick or simple visual inspection for the heat plate. the Voltage/L2 cache and S-Spec Must be verified.

Package Markings: Flip-Chip Pin Grid Array (FC-PGA)/FC-PGA2
These markings are located on the top side of the package. On one edge, the copyright, country of origin, speed of the processor, cache size, bus speed of the processor and voltage. On the opposite edge are the FPO serialization number, production specification (sSpec) number and the branding of the processor. Refer to the Specification Update for more detailed information. The FC-PGA2 packages are similar to the FC-PGA package except the FC-PGA2 use an Integrated Heat Spreader (IHS) that covers the die.

From Intel regarding the Tualatin core P-III's:

Pentium® III Processors
Pentium III processors Based on .13µ Process Technology

The size and spacing of the processor's transistors (silicon etchings) partially determine the transistor switching speed. The diameter of transistors is measured in microns (µ); one micron is one-millionth of a meter. A human hair is, on average, 30 microns in diameter. Smaller transistors can be packed more tightly in a given area. If they are closer together, there is less distance for the electrical signals to travel, creating a faster processor that runs cooler.

The original Pentium III processor was based on .25µ and the second version of the Pentium III processor was based on .18µ. The newest version of the Pentium III processor of the Pentium III processor is based on .13µ technology.

Important Note: When using a processor based on .13µ process technology, you must use a board specifically made to support these processors. Using this processor on the wrong motherboard will cause the processor to operate out of specification and void the manufacturers warranty.

Socket 370 CPU's are manufactured in PPGA/FC-PGA and FC-PGA2 packages. some older Socket 370 Motherboards can ONLY accept PPGA. conversely some newer Socket 370 motherboards can ONLY use FC-PGA. and in order to use the newest P-III "Tualatin", your motherboard must use the Intel 815E chipset with the B0 step code, or a VIA 694T chipset. please verify BIOS compatibility as well.

a special note-the Tualatin CPU are available in Uni and SMP configurations. in order to use Dual/SMP Tualatin P-III you MUST use the 512k L2 cache model! the P-III .13 micron w/256k L2 can ONLY be used in Uni-Processor systems!

All Celeron CPU's are not SMP validated. attempts to use Celerons in Dual/SMP configurations is done so at the end users risk, and is not guaranteed to work.

The Intel Pentium 4 CPU:

the Differences between the two packages according to Intel:

Pentium® 4 Processors Comparison Chart This chart compares the Pentium® 4 processors in the 423-pin package with Pentium 4 processors in the 478-pin package. The features and performance of the Pentium 4 processors built using the 0.18 micron process are the same for both packages. They support Intel® NetBurst™ micro-architecture including hyper-pipelined technology, a 400 MHz system bus, and Streaming SIMD extensions 2 (SSE2). They are both built using the 0.18 micron manufacturing process and include 256K L2 integrated cache. The Pentium 4 processor with 512 KB cache on 0.13 micron is available in the 478-pin package and includes twice as much L2 cache and either a 400 MHz or 533 MHz front side bus. The reason behind the pin package change is to electrically accommodate future Pentium 4 processors. Customers looking to upgrade their systems beyond 2 GHz should strongly consider purchasing a system that supports the 478-pin package. Both pin packages are supported by the Intel® 850 chipset, which provides the highest performing platform for the Pentium 4 processor. The Intel® 845 chipset family is integrated into motherboards designed for these processors, which extends support of the highest volume, most cost-effective memory shipping today. This allows new system price points and configuration options for Pentium 4 processor-based platforms. Identifying your Pentium 4 processor   Pentium® 4 Processors in the 423-package Pentium 4 Processors in the 478-pin package Pentium 4 Processors with 256 KB cache Pentium 4 Processors with 512 KB cache Micro-architecture Intel® NetBurst™ micro-architecture Intel NetBurst micro-architecture Intel NetBurst micro-architecture Operating frequencies (GHz) 1.30, 1.40, 1.50, 1.60, 1.70, 1.80, 1.90, and 2 GHz 1.50, 1.60, 1.70, 1.80, 1.90, and 2 GHz 1.60A, 1.80A, 2A, 2.20, 2.26, 2.40, 2.40B and 2.53 GHz Manufacturing process 0.18µ 0.18µ 0.13µ L2 Cache size 256K, on-die 256K, on-die 512K, on-die Socket Type PGA423 423 pins mPGA478B 478 pins mPGA478B 478 pins Memory Type PC800/600 RDRAM PC133 SDRAM PC800/600 RDRAM PC133 SDRAM DDR 200/266 SDRAM PC800/600 RDRAM PC133 SDRAM DDR 200/266 SDRAM Chipset Intel® 850 chipset Intel® 845 chipset Intel® 850E chipset Intel 850 chipset Intel 845 chipset Intel 850E chipset Intel 850 chipset Intel 850E chipset Intel 845 chipset Processor Core Voltage (Vcc_core) 1.75 V 1.75 V 1.50V System Bus Speed 400 MHz 400 MHz 400 MHz 533 MHz Dual Processor Support No No No

Links are provided to help assist you in making the correct purchase decisions. If you have further Questions please Contact RMA/Tech support Dept. or 281-575-0004